As the development of all sorts of technologies, semiconductor laser can have been received in a variety of solder skill is exhibited in application. In real industry production, semiconductor laser already can solder equipment of product of car, electron, medical treatment makes medium a lot of and sensitive component, and also can be offerred to food is packed and consume electronic market solder relevantly service. COMPACT (see a picture 1) it is the system of laser of high power semiconductor that German DILAS company rolls out, this system uses 19 inches of box of industrial standard to enclose, this kind of modular design concept, can offer for OEM supplier compact and concise solder solution. The output power range of COMPACT system is top can amount to 500W, offer standard interface and relevant port. System of laser of semiconductor of COMPACT of company of graph 1 DILAS in addition, DILAS company still is offerred for the application of COMPACT custom-built change fittings, if head of laser beam machining, optics is become,like system, Zhenjing scanning head is mixed pyrometer, increase opposite to produce the control of Cheng thereby, those who realize high quality solder the effect. Soldering introductory COMPACT system below plastic with the actual display case in chip metal. Plastic solder besides the tradition plastic solder outside the method, solder with laser plastic already was proved to be program of a kind of feasibility. Current, use laser beam welding to receive plan to be able to have soldered equipment of car, electron, medical treatment makes medium sensitive component, and can serve consume electronic market. With the tradition plastic solder methodological photograph is compared, laser is plastic solder have following advantages: The mechanical stress with the least · ; The thermal stress with the least · ; · solders steadily process; · huge solders flexibility; · arises completely without particle; · interior joins; The melt content spurt with small · ; · does not need additional absorbefacient; · high quality and solder firmly quality. Graph 2 in the actual condition of a few kinds of when the system of laser of actual condition COMPACT that showed a few kinds of when solder with COMPACT laser system plastic products solders plastic products. The reinforce of a few kinds of solder of system of laser of graph 2 COMPACT carries a component to solder without particle with example liquid, have close together welding line. Implementation is perfect the surface and firm the firm sex that soldering quick procedure has perfect face to come true solders, normally use jackknife and transmission of beam of light solder (Transmission Welding) . Of the laser energy to infra-red area absorb, come true through dye normally. Solder in transmission in, laser radiate passes through a component that is soldered, be absorbed by the another component that is soldered. Laser can solder now of a variety of color plastic, realize taller welder through adding all sorts of dye to weld firm sex. Photograph comparing is received at sticking, supersonic solder, vibration solders and heat solders wait to solder traditionally means, laser beam welding is received have a lot of advantage. Stick receive a constant need to undertake pretreatment to interface, and should use organic dissolvent. Although cost is inferior,heat solders, but its solder rate is relatively slow, and have happening of wear out condition easily; And, normally this kind solders hot influence area of the method is larger, solder because of what this does not suit sensitive component. Friction welding is received, vibration solders and ultrasonic solders, will to soldering the component brings to bear on greater mechanical power, this makes solder the structure is more complex, and need regular examination work. With afore-mentioned soldering methodological photograph is compared, the dominant position that laser beam welding accepts is highlighted. Laser beam welding receives the thermal stress with the youngest generation and mechanical stress. And, laser beam welding receives special cleanness, arise without grain, also do not need solvent, have high flexibility, soldering is being undertaken by the interior of connective body. Solder as actual as control application demonstrates the reliability of the process, use in reinforce of laser beam welding in, pyrometer is a very useful tool. COMPACT system of laser of high power semiconductor and pyrometer are used together, can realize blame contact temperature to measure, and can adjust quickly temperature keeps stable (see a picture 3) . Temperature of this kind of closed circuit controls a system, can make solder the process maintains from beginning to end undertake below a constant temperature, in order to avoid the loss that as a result of overheat place causes. The form that icon uses in the process window that the signal of temperature stability temperature that system of laser of semiconductor of high power of Nextpage graph 3 COMPACT and pyrometer use an implementation together can be in to define is shown racily come, can discover at any time so solder unqualified component, choose its come out. Besides, DILAS still raises color of sacrificial vessel equipment for the user the galvanometric scanner of corrective F-Theta lens. Wavelengh solders besides standard transmission outside wavelengh, system of laser of semiconductor of COMPACT high power still offers 1940nm wavelengh. In this wave band, below the situation that does not need to use any additional laser energy absorbefacient, can use what COMPACT system realizes transparent to two pellicle or two transparent component to solder. Soldering when transparent plastic product, DILAS still allows an user to use its patent product -- PCT/EP99/05109. Lame solders laser successive wave solders the effective method that the metal is course practice test and verify, can ensure of pinpoint accuracy solder process. COMPACT system can realize extensive accurate metal to solder, if solder electron yuan the product such as appliance of fittings and the compensator such as switch of parts of an apparatus, sensor, pressure or gas a powerful person, surgical operation, conduit and film. Should solder especially ply has 0 only. When the chip metal of 8mm, semiconductor laser comes true solder quality is apparent the laser of successive wave solid of riverside of excel lamp pump. Graph the 4 a few lame that showed with COMPACT the system comes true solder example. COMPACT construction of system is compact, function is efficient, and the operation is safeguarded very handy also. Its are soldering when lame, show following advantages: The dependability of · height and flexibility; · solders quality is good, need not operate repeatedly; · does not have auxiliary sex tool, do not have seam welding to receive; · solders rate is rapid; Cost of · opposite investment is low; Area of · hot influence is small, thermal stress is little. The chip metal with practical economy solders plan semiconductor laser is the most significant laser light source. The report of semiconductor laser - smooth transition efficiency yes the 10 times above of laser of solid of lamp pump riverside. Accordingly, semiconductor laser has relatively inferior use cost, taller efficiency to be mixed high compact structure, it is the solution with a kind of special practical economy. COMPACT system setup is simple, use convenient, can very easy ground is compositive in existing product line, and the high dependability of this system, also discharged an user of a lot of maintain and maintain cost. The high quality welding line that comes true with system of COMPACT semiconductor laser, because repeat the cost that treatment brings and time demand,can decrease. What the basis applies is different, semiconductor laser solders to be eliminated completely likely repeat treatment. Should solder ply when the metallic component under 1mm, need the output power of hundreds of tile only. Normally the circumstance falls, semiconductor laser can win the facula measure of 400~800 μ M, because of quality of this its beam of light already the Nd:Y with lamp pump riversideThe quality of beam of light of AG laser comparatives. Graph 5 it is to use COMPACT system to solder when the metal of different material solder speed and solder the relation curve between deepness. Graph 5 solder with COMPACT system when the metal of different material solder speed and solder the relation curve between deepness CNC Milling
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